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860-4G; SILICONE HEAT TRANSFER COMPOUND

M.G. Chemicals 860-4G
 
Our Price: $1.99
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Quantity in Stock:73

Product Code: 860-4G
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Description Specifications
 
Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. 4 grams.
Features
  • 860 is a CPU heat sink compound. Our thermal paste designed to reduce thermal resistance between irregular metal surfaces. Coupled with reasonable thermal conductivity, 860 has a soft consistency and a wide operating temperature range, which in some instances makes it the best thermal paste for CPU applications.

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