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KESTER 83-7145-0415 KESTER 83-7068-1402
SOLDER PAK .032" DIA .50 OZ SN62 / PB36 / AG02 Elec. Silver Solder Pocket Pak, 0.020 dia. Lead Free Pocket Pak Solder - 0.43 oz. - SN96.5/AG03/CU0.5
Tech Spray 1815-5F Tech Spray 1816-5F Tech Spray 1817-5F
Techspray No-Clean wick does not leave behind ionic flux residues that can collect and form branches called dendrites. Other fluxes, if not cleaned properly, can cause dendrites that grow over time (see A, B) and eventually cause short circuits between traces or leads (C). Latent failures lead to costly returns and lower the quality perception of your products. Effective on both lead and lead-free solders. Techspray No-Clean wick does not leave behind ionic flux residues that can collect and form branches called dendrites. Other fluxes, if not cleaned properly, can cause dendrites that grow over time (see A, B) and eventually cause short circuits between traces or leads (C). Latent failures lead to costly returns and lower the quality perception of your products. Effective on both lead and lead-free solders. Techspray No-Clean wick does not leave behind ionic flux residues that can collect and form branches called dendrites. Other fluxes, if not cleaned properly, can cause dendrites that grow over time (see A, B) and eventually cause short circuits between traces or leads (C). Latent failures lead to costly returns and lower the quality perception of your products. Effective on both lead and lead-free solders.
KESTER 83-3000-0000 KESTER 83-1000-0186 KESTER 83-1000-0951
Kester Kwik-Draw solder is the perfect tool box supply size. Solder feeds conveniently from the end of the handy dispenser tube. Contains 1.3 oz. 60% tin/40% lead 0.050" diameter rosin core solder. Kester Flux-Pen is a unique tool for rework and touch-up soldering. It allows controlled application of flux, eliminating the mess from flux bottles. The chisel point allows for work in very confined spaces. The flux pen is ideally suited for tab assembly no-clean and surface mount rework application because it can deliver flux to a specific area. Kester 186 has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. Kester 951 is a halogen-free, non-rosin organic Flux Pen that is specifically designed for rework of conventional and surface mount circuit board assemblies. The extremely low solids content (2.0%) and nature of the activator system results in practically NO RESIDUE left on the assembly after soldering. There are no residues to interfere with electrical testing. Kester 951 exhibits improved soldering performance to minimize solder bridges (shorts) during rework operations.
KESTER 24-4060-0066 KESTER 24-6040-0039 KESTER 24-6040-0061
SOLDER WIRE, 40/60 SN/PB, 230C, 1LB; External Diameter - Imperial:0.093"; Solder Gauge AWG:13AWG 44 Rosin Activated Core 60% Tin 40% Lead Solder Wire - Gauge 19, 1 pound 44 Rosin Activated Core 60% Tin 40% Lead Solder Wire - Gauge 16, 1 pound
KESTER 24-6040-0066 KESTER 24-6040-0053 KESTER 24-6040-0027
44 Rosin Activated Core 60% Tin 40% Lead Solder Wire - Gauge 13, 1 pound 44 Rosin Activated Core 60% Tin 40% Lead Solder Wire - Gauge 18, 1 pound 44 Series 0.79 3.3 % Core Size Sn60Pb40 Activated Rosin Cored Wire, 1 pound
KESTER 24-6337-0027 KESTER 24-6040-0018 KESTER 24-6337-0053
24-6337-0053, SOLDER
Our Price: $32.12
44 Rosin Activated Core 63% Tin 37% Lead Solder Wire - Gauge 21, 1 pound KESTER "44" Rosin core solder. .025 diameter, 60% tin, 40% lead alloy. Packaged in (1 lb spool). 44 Rosin Activated Core 63% Tin 37% Lead Solder Wire - Gauge 18, 1 pound
KESTER 24-6337-0010 Tech Spray 1815-100F
QUALITEK SILVER SOLDER 1/2 LB .032 44 Rosin Activated Core 63% Tin 37% Lead Solder Wire - Gauge 25, 1 pound Techspray No-Clean wick does not leave behind ionic flux residues that can collect and form branches called dendrites. Other fluxes, if not cleaned properly, can cause dendrites that grow over time (see A, B) and eventually cause short circuits between traces or leads (C). Latent failures lead to costly returns and lower the quality perception of your products. Effective on both lead and lead-free solders.
Tech Spray 1817-100F
Techspray No-Clean wick does not leave behind ionic flux residues that can collect and form branches called dendrites. Other fluxes, if not cleaned properly, can cause dendrites that grow over time (see A, B) and eventually cause short circuits between traces or leads (C). Latent failures lead to costly returns and lower the quality perception of your products. Effective on both lead and lead-free solders.